I/O backplane shields

Telecommunications and computer manufacturers are required to meet stringent EMC standards. This conductive foam offers a versatile design that can be die cut. These are ideal for low cycle applications such as I/O panels. Rectangular strips are also available.

• Die cut to customer specification
• RoHs compliant
• UL94 HB and V0
• Available in standard connectors sizes USB D-Sub RJ11
• Sheet stock available
• Range of thicknesses

For further information contact Arka Technologies